Winbond Manufacturer Handler Skill

Overview

WinbondHandler manages Winbond memory components including SPI Flash, NOR Flash, and EEPROM.

Supported Component Types

• MEMORY
• MEMORY_FLASH_WINBOND
• MEMORY_EEPROM_WINBOND
• MEMORY_FLASH
• MEMORY_EEPROM

MPN Patterns

SPI/QSPI Flash (W25 Series)

Prefix	Description
W25Qxx	Standard SPI/QSPI Flash
W25Nxx	SPI NAND Flash
W25Xxx	Legacy SPI Flash

NOR Flash (W29 Series)

Prefix	Description
W29Cxx	Parallel NOR Flash
W29Nxx	NOR Flash variant
W29Exx	NOR Flash variant

EEPROM (W24 Series)

Prefix	Description
W24xxx	Serial EEPROM

Package Codes

Suffix	Package
S, SS	SOIC
F	QFN
W	WSON
U	USON

Series Extraction

Returns base series including density code (e.g., "W25Q32JV" returns "W25Q32JV").

Package Code Extraction

Extracts suffix letters and maps to package type.

Custom matches() Implementation

Handler overrides

matches()

for direct pattern matching:

• W25[QNX][0-9]+ for SPI/QSPI Flash
• W29[CNE][0-9]+ for NOR Flash
• W24\d+ for EEPROM

Replacement Logic

• Same series with different package or variant are compatible
• Must have same density

Test Patterns

When testing WinbondHandler:

1. Use documentation tests for

   matches()

   behavior
2. Use assertions for

   extractPackageCode()

   ,

   extractSeries()

   , null handling
3. Instantiate directly:

   new WinbondHandler()

Known Handler Issues

All issues fixed in PR #88

Common Part Numbers

Part Number	Description
W25Q128JVSIQ	128Mbit QSPI Flash, SOIC-8
W25Q32JVSSIQ	32Mbit QSPI Flash, SOIC-8
W25Q64FVFIG	64Mbit QSPI Flash, QFN
W25N01GVZEIG	1Gbit SPI NAND Flash